
IWLPC 2026 in Fremont, USA
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Feb 17, 2026 - Feb 19, 2026
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46100 Landing Pkwy, Fremont, CA 94538, United States
- IT, digital e-commerce
About event
International technical conference of MEMS technologies, connections WLP Annual Inernational Wafer-Level Packaging Conference or IWLPC 2026. Main topics: MEMS packaging, 3D and IC packaging. Discussion and plenary papers provide an effective background for communicating and discussing these topics with a wide range of experts working in these fields. 65 participating companies with 195 stands, 650 participants, 16 countries will be represented, 43 technical documents will be reviewed.
Booth Construction at IWLPC
Our service focuses on designing personalised display booths that reflect your business and attract customers. As a leading exhibition booth design company, we combine aesthetics and practicality to create welcome and impactful spaces.
Our trade show booth construction skills and customer service are complementary. We carefully select exhibition stand materials within your budget to ensure quality and affordability. This method sets us apart as custom booth builders who deliver high-quality outcomes within budget.
From idea to completion, our services make your engagement easy and stress-free. Contact ESBAU to create a unique exhibition stand and brand experience for your next trade fair.
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ESBAU is not the event organizer. We are exhibition booth builders at events. For any information regarding the dates, location and conditions of participation in the event, please check the official website of the exhibition.
- Event type: Exhibition
- Event start date: Feb 17, 2026
- Event end date: Feb 19, 2026
- Country: USA
- City: Fremont
- Event category: IT, digital e-commerce
- Periodicity: Annually
- Exhibition Center: Fremont Marriott Silicon Valley
- Organizer: Surface Mount Technology Association SMTA