Electronic Components Materials Expo in 2025 in Tokyo, Japan

Jan 22, 2025 - Jan 24, 2025
3 Chome-11-1 Ariake, Koto, Tokyo 135 0063, Japan

About event

The international exhibition of electronic components, modules and components for consumer, industrial electronics and communications Electronic Components & Materials Expo (Ele Expo) will be held as part of a large-scale integrated project covering all aspects of the microelectronics industry NEPCON JAPAN, which includes 6 more exhibitions: Electrotest Japan, Internepcon Japan , IC Packaging Technology Expo, PWB Expo, Fine Process Technology Expo and LED & Laser Diode Technology Expo. Visitors to Ele Expo will be presented with the latest achievements in the semiconductor component industry and the technologies for their application, innovation, R&D, new ideas and solutions in the field of materials and design solutions for components for electronic production. The main thematic sections of the exhibition: basic electronic chip components and modules (active, passive, electromechanical, optoelectronic, wireless network components, etc.); a special section of sensors for automobiles, mechanical engineering, robotics; connectors and cable; materials and design solutions for components. In parallel, large-scale projects are being held: the exhibition of automotive technologies and components Automotive World, the exhibition of portable devices and technologies WEARABLE EXPO, the robotics exhibition RoboDEX and the exhibition of smart technologies SMART FACTORY Expo.

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ESBAU is not the event organizer. We are exhibition booth builders at events. For any information regarding the dates, location and conditions of participation in the event, please check the official website of the exhibition.